晶片的分割方法、装置、半导体器件的制造方法、制造装置

Method and apparatus for cleaving a wafer, method and apparatus for manufacturing semiconductor device

Abstract

在沿着晶片的劈开面的晶片分割线或切片线上边,形成由沟和贯通孔中的至少一方构成的劈开起点;向上述劈开的起点内注入液状物质;和加上物理性地变化的外部因素使上述液状物质变化,利用该变化劈开上述晶片以分割成一个一个的半导体芯片。
A starting point for cleavage made up of at least one of a groove and a through hole is formed on a chip dividing line or a dicing line along the cleaved surface of a wafer. Liquid matter is injected into the starting point. Then, the liquid matter is changed by applying an external factor that changes the liquid matter physically. Making use of the change, the wafer is cleaved so as to divide the wafer into semiconductor chips.

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